![]() Very careful local and overall temp control is imperative, in other words it can't be done by hand and needs an expensive rework machine/etc. You then need to heat the component to be removed, ball up the new component, clean up the pads and place the new component. You'll also have to ensure everything is kept very stable as obviously joints become less stable, even if the solder is still below reflow temp. ![]() Before you do this you'll have to remove any components/plastics/etc that can't survive this base temp. With a large complex logic board, BGA chips/etc you will find you will need to raise the temp of the entire board considerably. ![]() When you have free pads to play with and a smaller less complex board, free hand rework is possible.
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